microelectronic packaging

基本解释

It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。
With the development of microelectronic packaging technologies, anisotropic conductive adhesives(ACA)are widely used as one kind of the green materials in the electronic interconnection.
随着微电子封装技术的发展，各向异性导电胶作为一种绿色的连接材料，广泛应用于电子产品中。
The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力—应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。