SnAgCu

基本解释

There is no industry control limits for Copper and Lead in SnAgCu solder pot.
目前行业中没有用于SnAgCu焊料槽中铜和铅的控制极限。
A study in the reactions between SnAgCu lead-free solders and Au/Ni surface finish in BGA packages.
萧丽娟;化学工程与材料工程研究所;国立中央大学;硕士;2002-07-18
free-lead solder powder of SnAgCu system
SnAgCu系无铅焊锡粉末
Wetting Property of Surface Mount Componest for SnAgCu Solder Alloys
SnAgCu系钎料合金对表面贴装元件润湿特性研究
Research on the SnAgCu Lead Free Solder with Minute Amount Rare Earth Elements
添加微量稀土元素的SnAgCu无铅钎料的研究