SnAgCu

基本解释

There is no industry control limits for Copper and Lead in SnAgCu solder pot.
目前行業中沒有用於SnAgCu銲料槽中銅和鉛的控制極限。
A study in the reactions between SnAgCu lead-free solders and Au/Ni surface finish in BGA packages.
蕭麗娟;化學工程與材料工程研究所;國立中央大學;碩士;2002-07-18
free-lead solder powder of SnAgCu system
SnAgCu系無鉛銲錫粉末
Wetting Property of Surface Mount Componest for SnAgCu Solder Alloys
SnAgCu系釺料郃金對表麪貼裝元件潤溼特性研究
Research on the SnAgCu Lead Free Solder with Minute Amount Rare Earth Elements
添加微量稀土元素的SnAgCu無鉛釺料的研究